G10XB10-02

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Product Spectation

ParameterSymbolValue
Maximum Recurrent Peak Reverse VoltageVRRM100V
Maximum RMS VoltageVRMS70V
Maximum DC blocking VoltageVDC100V
Maximum average forward Tc = 100℃ Rectified output current at Ta = 25℃If(av)10A
Maximum average forward Tc = 100℃ Rectified output current at Ta = 25℃If(av)2.7A
Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated loadIFSM120A
Maximum Forward Voltage at rated Forward Current and 25°CVf1V
Maximum DC reverse current at Ta = 25°C rated DC blocking voltage per leg Ta = 125°C [Ta=25°C]Ir10μA
Maximum DC reverse current at Ta = 25°C rated DC blocking voltage per leg Ta = 125°C [Ta=125°C]Ir500μA
Maximum thermal resistance per legRth(jc)1.4°C/W
Operating junction and storage temperature rangeTj, TSTG-55to+150
Rating for fusing (t < 8.3ms)I2t-
Typical Thermal ResistanceRth(ja)-
Maximum Average Forward Rectified Current 3/8”lead length at Ta =55°CIf(av)-

Features

  • Glass passivated chip junction
  • Ideal for printed circuit board
  • High surge current capability
  • High case dielectric strength
  • This series is UL listed under Recognized Component Index,
  • file number E330278

Mechanical Data

Terminal
Plated leads solderable per J-STD-002
Case
UL-94 Class V-0 recognized Flame Retardant Epoxy
Polarity
Polarity symbol marked on body
Mounting Position
any
Marking
G10B05 Thru G10B100

Notes

  • [1]junction to case, with heatsink
  • [2]junction to ambient, without heatsink 3.Thermal Resistance from Junction to Case with Device Mounted on 75mm×75mm×1.6mm Cu Plate Heatsink