G10XB80H-E-47L

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Product Spectation

ParameterSymbolValue
Maximum Recurrent Peak Reverse VoltageVRRM800V
Maximum RMS VoltageVRMS560V
Maximum DC blocking VoltageVDC800V
Maximum average forward Tc = 100℃ Rectified output current at Ta = 25℃If(av)10A
Maximum average forward Tc = 100℃ Rectified output current at Ta = 25℃If(av)2.9A
Peak forward surge current 10ms single sine-wave superimposed on rated loadIFSM170A
Peak forward surge current (t ≤1.0ms)IFSM340A
Peak forward surge current (t ≤1.0ms) Tj = 25℃ Tj = 125℃IFSM450A
Maximum Forward Voltage at rated Forward Current and 25°CVf1.05V
Rating for fusing (t < 8.3ms)I2t135A²·s
Maximum DC reverse current at Ta = 25°C rated DC blocking voltage per leg Ta = 125°C [Ta=25°C]Ir10μA
Maximum DC reverse current at Ta = 25°C rated DC blocking voltage per leg Ta = 125°C [Ta=125°C]Ir250μA
Typical Thermal ResistanceRth(ja)26°C/W
Maximum thermal resistance per legRth(jc)1.9°C/W
Operating junction and storage temperature rangeTj, TSTG-55to+150
Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated loadIFSM-
Maximum Average Forward Rectified Current 3/8”lead length at Ta =55°CIf(av)-

Features

  • Glass passivated chip junction
  • Ideal for printed circuit board
  • High Ifsm
  • High surge current capability
  • High case dielectric strength
  • Halogen Free

Mechanical Data

Terminal
Plated leads solderable per J-STD-002
Case
UL-94 Class V-0 recognized Halogen Free Epoxy
Polarity
Polarity symbol marked on body
Mounting Position
any

Notes

  • [1]junction to case, with heatsink
  • [2]junction to ambient, without heatsink
  • [3]Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screw