GSB22ML-E
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
- Category
- SMD Bridge Rectifier
- Datasheet
- GSB22ML-E
Product Spectation
| Parameter | Symbol | Value |
|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM | 1000V |
| Maximum RMS Voltage | VRMS | 700V |
| Maximum DC blocking Voltage | VDC | 1000V |
| Maximum Average Forward Rectified Current 3/8”lead length at Ta =55°C | If(av) | 2.2A |
| Peak Forward Surge Current 8.3ms Tj = 25℃ single half sine-wave Tj = 125℃ | IFSM | 90A |
| Peak Forward Surge Current 8.3ms Tj = 25℃ single half sine-wave Tj = 125℃ | IFSM | 70A |
| Peak forward surge current (t ≤1.0ms) | IFSM | 180A |
| Peak forward surge current (t ≤1.0ms) Tj = 25℃ Tj = 125℃ | IFSM | 145A |
| Rating for fusing (t < 8.3ms) | I2t | 33.6A²·s |
| Maximum Forward Voltage at rated Forward Current and 25°C | Vf | 0.92V |
| Maximum DC Reverse Current Ta =25℃ at rated DC blocking voltage Ta =125℃ | Ir | 5μA |
| Maximum DC Reverse Current Ta =25℃ at rated DC blocking voltage Ta =125℃ | Ir | 100μA |
| Maximum thermal resistance per leg | Rth(jc) | 9.6°C/W |
| Typical Junction Capacitance | Cj | 35pF |
| Storage and Operating Junction Temperature | TSTG, Tj | -55to+150 |
| Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load | IFSM | - |
| Typical Thermal Resistance | Rth(jl) | - |
| Typical Thermal Resistance | Rth(ja) | - |
Features
- Ideal for SMT manufacturing
- Glass passivated chip
- Compact, thin profile package design
- Reliable low cost construction utilizing molded plastic
- technique
- Low forward voltage
- High surge current capability
- High temperature soldering guaranteed: 260℃/10 seconds
- This series is UL listed under Recognized Component Index, file
- number E481337
- Halogen Free
Mechanical Data
- Terminal
- Plated leads solderable per J-STD-002
- Case
- UL-94 Class V-0 recognized Halogen Free Epoxy
- Polarity
- Polarity symbol marked on body
- Marking
- GB22ML
Notes
- [1]Unit mounted on glass-epoxy substrate with 1oz/ft2 20×20mm copper pad per pin with 1oz/ft2 20×20mm copper pad per pin _ _
- [2]Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc