GSB30M-E-80C
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
- Category
- SMD Bridge Rectifier
- Datasheet
- GSB30M-E_OPPO
Product Spectation
| Parameter | Symbol | Value |
|---|---|---|
| Maximum Recurrent Peak Reverse Voltage | VRRM | 1000V |
| Maximum RMS Voltage | VRMS | 700V |
| Maximum DC blocking Voltage | VDC | 1000V |
| Maximum Average Forward Rectified Current 3/8”lead length at Ta =55°C | If(av) | 3A |
| Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load | IFSM | 110A |
| Rating for fusing (t < 8.3ms) | I2t | 50.21A²·s |
| Maximum Forward Voltage at rated Forward Current and 25°C | Vf | 1.02V |
| Maximum DC Reverse Current Ta =25℃ at rated DC blocking voltage Ta =125℃ | Ir | 5μA |
| Maximum DC Reverse Current Ta =25℃ at rated DC blocking voltage Ta =125℃ | Ir | 500μA |
| Thermal resistance with heatsink without heatsink | Rth(jc) | 9°C/W |
| Thermal resistance with heatsink without heatsink | Rth(jc) | 5°C/W |
| Typical Junction Capacitance | Cj | 45pF |
| Storage and Operating Junction Temperature | TSTG, Tj | -55to+150 |
| Typical Thermal Resistance | Rth(jl) | - |
| Typical Thermal Resistance | Rth(ja) | - |
Features
- Ideal for SMT manufacturing
- Glass passivated chip
- Compact, thin profile package design
- Reliable low cost construction utilizing molded plastic
- technique
- High surge current capability
- High temperature soldering guaranteed: 260℃/10 seconds
- This series is UL listed under Recognized Component Index,
- file number E481337
- Halogen Free
Mechanical Data
- Terminal
- Plated leads solderable per J-STD-002
- Case
- UL-94 Class V-0 recognized Halogen Free Epoxy
- Polarity
- Polarity symbol marked on body
- Marking
- GB30M
Notes
- [1]Unit mounted on 15×15×1.6mm AL pad
- [2]Unit mounted on 15×15×1.6mm AL pad attach 50×50×1mm copper plate heatsink
- [3]Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc