LLD06-41C

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Product Spectation

ParameterSymbolValue
Maximum Recurrent Peak Reverse VoltageVRRM600V
Maximum RMS VoltageVRMS420V
Maximum DC blocking VoltageVDC600V
Maximum Average Forward Rectified Current 3/8”lead length at Ta =55°CIf(av)0.8A
Peak forward surge current single sine-wave superimposed on rated load (JEDEC Method)IFSM40@8.3ms
Peak forward surge current square wave on rated loadIFSM80@1ms
Maximum Forward Voltage at rated Forward Current and 25°CVf1V
Maximum DC Reverse Current at V =325V and Tc =25℃ DCIr1μA
Maximum DC Reverse Current Ta =25℃ at rated DC blocking voltage Ta =125℃Ir5μA
Maximum DC Reverse Current Tc =25℃ at rated DC blocking voltage Tc =120℃Ir100μA
Total power dissipatioPTOT1.28W
Typical Thermal ResistanceRth(ja)70°C/W
Maximum thermal resistance per legRth(jc)45°C/W
Typical Thermal ResistanceRth(jl)20°C/W
Typical Junction CapacitanceCj15pF
Storage and Operating Junction TemperatureTSTG, Tj-55to+150
Maximum DC Reverse Current Ta =25℃ at rated DC blocking voltage Ta =125℃Ir-
Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated loadIFSM-

Features

  • Low profile space
  • Ideal for automated placement
  • Glass passivated chip
  • Low forward voltage drop
  • Low leakage current
  • High forward surge capability
  • High temperature soldering: 260℃/10 seconds

Mechanical Data

Terminal
Plated leads solderable per J-STD-002
Case
UL-94 Class V-0 recognized Flame Retardant Epoxy
Polarity
Polarity symbol marked on body

Notes

  • [1]Tc=25℃(according to calculations)
  • [2]On aluminum substrate P.C.B. with an area of 0.8”×0.8”(20×20mm) mounted on 0.05×0.05”(1.3×1.3mm) solder pad
  • [3]Measured at 1.0 MHz and applied voltage of 4.0 volt