RLLD02

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Product Spectation

ParameterSymbolValue
Maximum Recurrent Peak Reverse VoltageVRRM200V
Maximum RMS VoltageVRMS140V
Maximum DC blocking VoltageVDC200V
Maximum Average Forward Rectified Current 3/8”lead length at Ta =55°CIf(av)0.8A
Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated loadIFSM35A
Maximum Forward Voltage at rated Forward Current and 25°CVf1.3V
Maximum Reverse Recovery TimeTRR150ns
Maximum DC Reverse Current Ta =25℃ at rated DC blocking voltage Ta =125℃Ir5μA
Maximum DC Reverse Current Ta =25℃ at rated DC blocking voltage Ta =125℃Ir100μA
Typical Thermal ResistanceRth(ja)70°C/W
Typical Thermal ResistanceRth(jl)20°C/W
Typical Junction CapacitanceCj15pF
Storage and Operating Junction TemperatureTSTG, Tj-55to+150

Features

  • Low profile space
  • Ideal for automated placement
  • Glass passivated chip
  • Fast recovery time for high efficiency
  • Low forward voltage drop
  • Low leakage current
  • High forward surge capability
  • High temperature soldering: 260℃/10 seconds

Mechanical Data

Terminal
Plated leads solderable per J-STD-002
Case
UL-94 Class V-0 recognized Flame Retardant Epoxy
Polarity
Polarity symbol marked on body

Notes

  • [1]Reverse Recovery Condition I = 0.5A, I = 1.0A, I = 0.25A F R RR
  • [2]On aluminum substrate P.C.B. with an area of 0.8”×0.8”(20×20mm) mounted on 0.05×0.05”(1.3×1.3mm) solder pad
  • [3]Measured at 1.0 MHz and applied voltage of 4.0 volt