SB260A-41C

Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

Product Spectation

ParameterSymbolValue
Maximum Recurrent Peak Reverse VoltageVRRM60V
Maximum RMS VoltageVRMS42V
Maximum DC blocking VoltageVDC60V
Maximum average forward Tc = 100℃ Rectified output current at Ta = 25℃If(av)2.0@TL=75℃
Maximum average forward Tc = 100℃ Rectified output current at Ta = 25℃If(av)0.5@Tc=120℃
Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated loadIFSM50A
Inrush Current with 10Ω and 20uF foil capacitor placed in series to the DUT 10000 times, 10s between each pulse Tc=120℃Ifsm-150min
Maximum Forward Voltage at rated Forward Current and 25°CVf0.7V
Maximum DC Reverse Current Ta =25ºC at rated DC blocking voltage Ta =100ºCIr0.5mA
Maximum DC Reverse Current Ta =25ºC at rated DC blocking voltage Ta =100ºCIr3mA
Maximum DC Reverse Current Tc =25℃ at rated DC blocking voltage Tc =100℃ Tc =120℃Ir8mA
Power dissipation at tamp=25°CPTOT1400mW
Maximum Reverse Recovery Time Tc =25℃ Tc =120℃TRR7ns
Maximum Reverse Recovery Time Tc =25℃ Tc =120℃TRR9ns
Typical Thermal ResistanceRth(ja)50°C/W
Maximum thermal resistance per legRth(jc)30°C/W
Storage and Operating Junction TemperatureTSTG, Tj-55to+150
Maximum Average Forward Rectified Current 3/8”lead length at Ta =55°CIf(av)-

Features

  • High current capability, Low forward voltage drop
  • Low power loss, high efficiency
  • High surge capability
  • High temperature soldering guaranteed
  • 250°C /10sec/0.375" lead length at 5 lbs tension

Mechanical Data

Terminal
Plated axial leads solderable per MIL-STD 202E, method 208C
Case
Molded with UL-94 Class V-0 recognized Flame Retardant Epoxy
Polarity
color band denotes cathode
Mounting Position
any

Notes

  • [1]Pulse test : 300uS pulse width ,1% duty cycle.
  • [2]Tc=25℃(according to calculations)
  • [3]Reverse Recovery Condition If =0.5A, Ir =1.0A, Irr =0.25A
  • [4]Thermal Resistance from Junction to Ambient at 0.5" lead length, vertical P.C. Board Mounted
  • [5]Thermal Resistance from Junction to Case